汕頭豐利達工藝技術能力
汕頭豐利達工藝技術能力
項目 |
正片流程 |
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最小 |
最大 |
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成品板厚 |
0.4mm |
3.5mm |
|
鉆咀孔徑 |
0.2mm |
6.50mm |
|
鉆孔孔徑公差(指成品) |
PTH:±3mil/NPTH: ±2mil |
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|
鉆孔孔位公差(指成品) |
±3mil |
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|
孔壁粗糙度 |
● |
<1000μ" |
|
釘頭 |
● |
<75% |
|
槽刀 |
0.6mm |
○ |
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板厚孔徑比 |
● |
≦8:1 |
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孔銅厚均勻性 |
80%以上 |
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外層線寬(原稿)mil |
4 |
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外層線距(原稿)mil |
4 |
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線寬公差 |
±20% |
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|
綠油對準度 |
+/-3mil |
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|
Solder Dam( 綠油橋 ) |
4mil |
● |
|
成品塞孔孔徑 |
0.2mm |
0.6mm |
|
文字寬度/高度 |
5mil/31.5mil |
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|
文字間距(字符到焊盤) |
5mil |
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噴錫厚度 |
20u" |
1000u" |
|
沉鎳厚度 |
80u" |
200u" |
|
電金厚度 |
0.2u" |
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|
沉金厚度 |
1u" |
5u" |
|
金手指鎳厚 |
100u" |
250u" |
|
金手指金厚 |
1u" |
80u" |
|
OSP(抗氧化)厚度 |
0.2um |
0.5um |
|
CNC公差 |
±0.15mm |
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|
PUNCH(模沖)公差 |
±0.1mm |
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|
V-CUT余厚公差 |
±0.10mm |
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V-CUT成型邊距離 |
3mm |
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BGA球間距 |
有鉛20mil/無鉛16mil |
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